Opto-Electronics Packaging And Failure Analysis Methodology
نویسنده
چکیده
The demand for opto-electronics is increasing as we are nearing the future due to the need for high data rate, high bandwidth, lossless transmission and low electromagnetic interference sensitivity. The paper describes the present research carried on the mature laser technology i.e. GaAs, in order to improve its efficiency. The packaging principle used for receivers can be applied for the packaging of the laser driver circuit and the laser source in a single module. The concept of FRACAS (Failure Reporting, Analysis and Corrective Action System) has been described and failure analysis technique for Electrical overstress (EOS) is described. An industrial approach to calculating the reliability of a system with some known data facts has been described. Some challenges with respect to packaging have been discussed in detail and some methods to overcome challenges such as lattice mismatch have been described.
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